TXS0206
- Level Translator
- VCCA and VCCB Range of 1.1 V to 3.6 V
- Fast Propagation Delay (4 ns Max When Translating
Between 1.8 V and 3 V)
- Integrated EMI Filtering and ESD Protection Circuitry
- ESD Protection Exceeds JESD 22 (A Port)
- 2500-V Human-Body Model (A114-B)
- 250-V Machine Model (A115-A)
- 1500-V Charged-Device Model (C101)
- ±8-kV Contact Discharge IEC 61000-4-2 ESD (B-port)
All other trademarks are the property of their respective owners.
The TXS0206 is a level shifter for interfacing microprocessors with MultiMediaCards (MMCs), secure digital (SD) cards, and Memory Stick™ cards. It includes a high-speed level translator along with ESD protection and EMI filtering circuitry.
The voltage-level translator has two supply voltage pins. VCCA as well as VCCB can be operated over the full range of 1.1 V to 3.6 V. The TXS0206 enables system designers to easily interface applications processors or digital basebands to memory cards and SDIO peripherals operating at a different I/O voltage level.
Memory card standards recommend high-ESD protection for devices that connect directly to the external memory card. To meet this need, the TXS0206 incorporates ±8-kV Contact Discharge protection on the card side.
The TXS0206 is offered in a 20-bump wafer chip scale package (WCSP). This package has dimensions of 1.96 mm × 1.56 mm, with a 0.4-mm ball pitch for effective board-space savings. Memory cards are widely used in mobile phones, PDAs, digital cameras, personal media players, camcorders, set-top boxes, etc. Low static power consumption and small package size make the TXS0206 an ideal choice for these applications.
技术文档
| 类型 | 标题 | 下载最新的英语版本 | 日期 | |||
|---|---|---|---|---|---|---|
| * | 数据表 | TXS0206 MMC, SD Card, Memory Stick(TM) Voltage-Translation Transceiver 数据表 (Rev. C) | 2010年 1月 6日 | |||
| 应用手册 | Understanding Transient Drive Strength vs. DC Drive Strength in CMOS Output Buffers | PDF | HTML | 2024年 5月 14日 | |||
| 应用手册 | SDIO 的电压转换 | PDF | HTML | 英语版 | PDF | HTML | 2022年 5月 19日 | |
| 选择指南 | Voltage Translation Buying Guide (Rev. A) | 2021年 4月 15日 | ||||
| 更多文献资料 | Voltage-Level Translation Guide (Rev. H) | 2015年 8月 31日 |
设计和开发
如需其他信息或资源，请点击以下任一标题进入详情页面查看（如有）。
| 封装 | 引脚 | 下载 |
|---|---|---|
| DSBGA (YFP) | 20 | 查看选项 |
订购和质量
- RoHS
- REACH
- 器件标识
- 引脚镀层/焊球材料
- MSL 等级/回流焊峰值温度
- MTBF/时基故障估算
- 材料成分
- 鉴定摘要
- 持续可靠性监测
- 制造厂地点
- 封装厂地点