ZHCSR64C december   2022  – may 2023 INA351

PRODUCTION DATA  

  1.   1
  2. 1 特性
  3. 2 应用
  4. 3 说明
  5. 4 Revision History
  6. 5 Device Comparison Table
  7. 6 Pin Configuration and Functions
  8. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Typical Characteristics
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Gain-Setting
        1. 8.3.1.1 Gain Error and Drift
      2. 8.3.2 Input Common-Mode Voltage Range
      3. 8.3.3 EMI Rejection
      4. 8.3.4 Typical Specifications and Distributions
      5. 8.3.5 Electrical Overstress
    4. 8.4 Device Functional Modes
  10. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Reference Pin
      2. 9.1.2 Input Bias Current Return Path
    2. 9.2 Typical Applications
      1. 9.2.1 Resistive-Bridge Pressure Sensor
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
        3. 9.2.1.3 Application Curves
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Device Support
      1. 10.1.1 Development Support
        1. 10.1.1.1 PSpice® for TI
    2. 10.2 Documentation Support
      1. 10.2.1 Related Documentation
    3. 10.3 接收文档更新通知
    4. 10.4 支持资源
    5. 10.5 Trademarks
    6. 10.6 静电放电警告
    7. 10.7 术语表
  12. 11Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

7.4 Thermal Information

THERMAL METRIC(1) INA351ABS, INA351CDS UNIT
DDF (SOT-23-THN)(2) DSG (WSON) RUG (X2QFN)
8 PINS 8 PINS 10 PINS
RθJA Junction-to-ambient thermal resistance 172.1 80.3 174.7 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 90.1 100.4 63.2 °C/W
RθJB Junction-to-board thermal resistance 88.2 46.4 99.6 °C/W
ψJT Junction-to-top characterization parameter 7.3 5.3 1.3 °C/W
ψJB Junction-to-board characterization parameter 88.0 46.4 99.2 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance n/a 21.9 n/a °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.
(2) The package is for preview only.
开云买球「中国」股份有限公司 | 天博游戏app|中国有限公司 | 英亚体育【中国】有限公司 | 电竞app官网（中国）有限公司 | 千亿体育(中国)有限公司官网 | 欧博游戏官网【中国】有限公司 | IM·电竞（中国）官方网站 | 博鱼体育（中国）有限公司官网 | 易倍体育（中国）有限公司 |