SNCS104D April   2005  – December 2014 LMH6570

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics ±5V
    6. 6.6 Electrical Characteristics ±3.3V
    7. 6.7 Typical Performance Characteristics
  7. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Application
      1. 7.2.1 Video Performance
      2. 7.2.2 Feedback Resistor Selection
      3. 7.2.3 Multiplexer Expansion
      4. 7.2.4 Other Applications
      5. 7.2.5 Driving Capacitive Loads
      6. 7.2.6 ESD Protection
  8. 8 Power Supply Recommendations
    1. 8.1 Power Dissipation
  9. 9 Layout
    1. 9.1 Layout Guidelines
  10. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 Trademarks
    3. 10.3 Electrostatic Discharge Caution
    4. 10.4 Glossary
  11. 11Mechanical, Packaging, and Orderable Information

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8 Power Supply Recommendations

8.1 Power Dissipation

The LMH6570 is optimized for maximum speed and performance in the small form factor of the standard SOIC package. To ensure maximum output drive and highest performance, thermal shutdown is not provided. Therefore, it is of utmost importance to make sure that the TJMAX is never exceeded due to the overall power dissipation.

Follow these steps to determine the maximum power dissipation for the LMH6570:

  1. Calculate the quiescent (no-load) power:
    2. Equation 1. PAMP = ICC* (VS),

    where

    • VS = V+ - V−
  2. Calculate the RMS power dissipated in the output stage:
    3. Equation 2. PD (rms) = rms ((VS - VOUT) * IOUT)

    where

    • VOUT and IOUT are the voltage across
    • The current through the external load and VS is the total supply voltage
  3. Calculate the total RMS power:
    4. Equation 3. PT = PAMP + PD

The maximum power that t-he LMH6570 package can dissipate at a given temperature can be derived with the following equation:

Equation 4. PMAX = (150° – TAMB)/ RθJA

where

  • TAMB = Ambient temperature (°C)
  • RθJA = Thermal resistance, from junction to ambient, for a given package (°C/W)
  • For the SOIC package RθJA is 150 °C/W
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