ZHCSOS5E May   2022  – June 2024 OPA2863A , OPA863A

PRODUCTION DATA  

  1.   1
  2. 1 特性
  3. 2 应用
  4. 3 说明
  5. 4 Device Comparison Table
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information OPA863A
    5. 6.5  Thermal Information OPA2863A
    6. 6.6  Electrical Characteristics VS = ±5 V
    7. 6.7  Electrical Characteristics VS = 3 V
    8. 6.8  Typical Characteristics: VS = ±5 V
    9. 6.9  Typical Characteristics: VS = 3 V
    10. 6.10 Typical Characteristics: VS = 3 V to 10 V
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Input Stage
      2. 7.3.2 Output Stage
        1. 7.3.2.1 Overload Power Limit
      3. 7.3.3 ESD Protection
    4. 7.4 Device Functional Modes
      1. 7.4.1 Power-Down Mode
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 Active Filters
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curves
      2. 8.2.2 Low-Power SAR ADC Driver and Reference Buffer
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 接收文档更新通知
    3. 9.3 支持资源
    4. 9.4 Trademarks
    5. 9.5 静电放电警告
    6. 9.6 术语表
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • DBV|5
散热焊盘机械数据 (封装 | 引脚)
订购信息

6.5 Thermal Information OPA2863A

THERMAL METRIC(1) OPA2863A UNIT
D (SOIC) DGK (VSSOP) DSN (USON)
8 PINS 8 PINS 10 PINS
RθJA Junction-to-ambient thermal resistance 120.0 180.3 52.4 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 63.3 67.5 41.7 °C/W
RθJB Junction-to-board thermal resistance 63.2 101.9 25.5 °C/W
ΨJT Junction-to-top characterization parameter 17.2 9.8 0.6 °C/W
ΨJB Junction-to-board characterization parameter 62.5 100.1 25.5 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance N/A N/A 8.1 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.
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