ZHCSAH8B November   2012  – March 2022 TFP401A-Q1

PRODUCTION DATA  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  DC Digital I/O Electrical Characteristics
    6. 6.6  DC Electrical Characteristics
    7. 6.7  AC Electrical Characteristics
    8. 6.8  Timing Requirements
    9. 6.9  Switching Characteristics
    10. 6.10 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 TMDS Pixel Data and Control Signal Encoding
      2. 7.3.2 TFP401A-Q1 Clocking and Data Synchronization
      3. 7.3.3 TFP401A-Q1 TMDS Input Levels and Input Impedance Matching
      4. 7.3.4 TFP401A-Q1 Device Incorporates HSYNC Jitter Immunity
    4. 7.4 Device Functional Modes
      1. 7.4.1 TFP401A-Q1 Modes of Operation
      2. 7.4.2 TFP401A-Q1 Output Driver Configurations
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Typical Application
        1. 8.1.1.1 Design Requirements
        2. 8.1.1.2 Detailed Design Procedure
          1. 8.1.1.2.1 Data and Control Signals
          2. 8.1.1.2.2 Configuration Options
          3. 8.1.1.2.3 Power Supplies Decoupling
        3. 8.1.1.3 Application Curves
        4. 8.1.1.4 DVDD
        5. 8.1.1.5 OVDD
        6. 8.1.1.6 AVDD
        7. 8.1.1.7 PVDD
    2. 8.2 Power Supply Recommendations
    3. 8.3 Layout
      1. 8.3.1 Layout Guidelines
        1. 8.3.1.1 Layer Stack
        2. 8.3.1.2 Routing High-Speed Differential Signal Traces (RxC-, RxC+, Rx0-, Rx0+, Rx1-, Rx1+, Rx2-, Rx2+)
      2. 8.3.2 Layout Example
      3. 8.3.3 TI PowerPAD 100-TQFP Package
  9. 9 Device and Documentation Support
    1. 9.1 接收文档更新通知
    2. 9.2 支持资源
    3. 9.3 Trademarks
    4. 9.4 Electrostatic Discharge Caution
    5. 9.5 术语表
  10. 10Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

6.9 Switching Characteristics

over operating free-air temperature range (unless otherwise noted)
PARAMETERTEST CONDITIONSMINTYPMAXUNIT
tpd(PDL)Propagation delay time from PD low to Hi-Z outputs9ns
tpd(PDOL)Propagation delay time from PDO low to Hi-Z outputs9ns
tt(HSC)Delay time from DE transition to SCDT low(7)1e6tpix
tt(FSC)Delay time from DE transition to SCDT high(7)1600tpix
td(st)Delay time, ODCK latching edge to QE[23:0] data outputSTAG = low, PIXS = high0.25tpix
GUID-F2CBC2F9-3992-44E7-8254-080B15A744B4-low.gifFigure 6-10 Analog Input Intra-Pair Differential Skew
GUID-F2F2DE60-937F-42AB-AC96-5831FCD8661F-low.gifFigure 6-11 Minimum Time PD Low
GUID-AAC7A270-8C86-4D22-AD51-59373372B70C-low.gifFigure 6-12 Analog Input Channel-to-Channel Skew
GUID-B3D874E6-98D0-43D9-A3DF-2A73DECA5D7F-low.gifFigure 6-13 Minimum DE Low and Maximum DE High
开云买球「中国」股份有限公司 | 天博游戏app|中国有限公司 | 英亚体育【中国】有限公司 | 电竞app官网（中国）有限公司 | 千亿体育(中国)有限公司官网 | 欧博游戏官网【中国】有限公司 | IM·电竞（中国）官方网站 | 博鱼体育（中国）有限公司官网 | 易倍体育（中国）有限公司 |