ZHCSSO5A July   2023  – October 2023 TPS7H2140-SEP

PRODUCTION DATA  

  1.   1
  2. 1 特性
  3. 2 应用
  4. 3 说明
  5. 4 Revision History
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
    7. 6.7 Typical Characteristics
  8. 7 Parameter Measurement Information
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Pin Current and Voltage Conventions
      2. 8.3.2 Accurate Current Sense
      3. 8.3.3 Adjustable Current Limit
      4. 8.3.4 Inductive-Load Switching-Off Clamp
      5. 8.3.5 Fault Detection and Reporting
        1. 8.3.5.1 Diagnostic Enable Function
        2. 8.3.5.2 Multiplexing of Current Sense
        3. 8.3.5.3 Fault Table
        4. 8.3.5.4 FAULT Reporting
      6. 8.3.6 Full Diagnostics
        1. 8.3.6.1 Short-to-GND and Overload Detection
        2. 8.3.6.2 Open-Load Detection
          1. 8.3.6.2.1 Channel On
          2. 8.3.6.2.2 Channel Off
        3. 8.3.6.3 Short-to-Input Detection
        4. 8.3.6.4 Reverse Polarity Detection
        5. 8.3.6.5 Thermal Fault Detection
          1. 8.3.6.5.1 Thermal Shutdown
      7. 8.3.7 Full Protections
        1. 8.3.7.1 UVLO Protection
        2. 8.3.7.2 Loss-of-GND Protection
        3. 8.3.7.3 Protection for Loss of Power Supply
        4. 8.3.7.4 Reverse-Current Protection
        5. 8.3.7.5 MCU I/O Protection
      8. 8.3.8 Parallel Operation
    4. 8.4 Device Functional Modes
      1. 8.4.1 Working Modes
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Examples
        1. 9.4.2.1 Without a GND Network
        2. 9.4.2.2 With a GND Network
  11. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 接收文档更新通知
    3. 10.3 支持资源
    4. 10.4 Trademarks
    5. 10.5 静电放电警告
    6. 10.6 术语表
  12. 11Mechanical, Packaging, and Orderable Information

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5 Pin Configuration and Functions

GUID-20230120-SS0I-KLMW-3RFR-18PGKJXJ00NJ-low.svg Figure 5-1 PWP Package
28-Pin HTSSOP With Exposed Thermal Pad
(Top View)
Table 5-1 Pin Functions
PIN I/O(1) DESCRIPTION
NAME NO.
CL 11 O Adjustable current limit. Connect to device GND if external current limit is not used.
CS 10 O Current-sense output.
DIAG_EN 14 I Enable-disable pin for diagnostics; internal pulldown.
FAULT 9 O Global fault report with open-drain structure, ORed logic for quad-channel fault conditions.
GND 1, 12 — Ground pin.
EN1 3 I Input control for channel 1 activation; internal pulldown.
EN2 4 I Input control for channel 2 activation; internal pulldown.
EN3 5 I Input control for channel 3 activation; internal pulldown.
EN4 6 I Input control for channel 4 activation; internal pulldown.
NC 2, 19, 24 — No connect. This pin is not internally connected. It is recommended to connect this pin to GND to prevent charge buildup; however, this pin can also be left open or tied to any voltage between GND and IN.
SEH 7 I CS channel-selection high bit; internal pulldown.
SEL 8 I CS channel-selection low bit; internal pulldown.
THER 13 I Thermal shutdown behavior control, latch off or auto-retry; internal pulldown.
OUT1 27, 28 O Output of the channel 1 high side-switch, connected to the load.
OUT2 25, 26 O Output of the channel 2 high side-switch, connected to the load.
OUT3 17, 18 O Output of the channel 3 high side-switch, connected to the load.
OUT4 15, 16 O Output of the channel 4 high side-switch, connected to the load.
IN 20, 21, 22, 23 I Power supply.
Thermal pad — — Connect to device GND or leave floating.
(1) I = Input, O = Other, — = Other
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